BEGIN:VCALENDAR VERSION:2.0 PRODID:-//Memento EPFL// BEGIN:VEVENT SUMMARY:U.S. DOD DARPA - Microsystems Technology Office (MTO) Office-wide DTSTART;VALUE=DATE:20230316 DTSTAMP:20260406T184208Z UID:51ad66fa549fed44bd847c9940a3fb16476557574e67eaff869d0f5f CATEGORIES:Call for proposal DESCRIPTION:The Microsystems Technology Office (MTO) at DARPA regularly pu blishes BAAs requesting responses to specific program topics.\n\nMTO seeks to develop high-risk\, high-reward technologies. Proposed research should investigate innovative approaches that enable revolutionary advances in s cience\, devices\, or systems. Specifically excluded is research that prim arily results in evolutionary improvements to the existing state of practi ce.\n\nAs MTO evolves to address future microsystems-related challenges\, the office has identified four thrust areas: (1) Embedded Microsystem Inte lligence and Localized Processing\, (2) Next Generation Front-End Componen t Technologies for Electromagnetic (EM) Spectrum Dominance\, (3) Microsyst em Integration for Increased Functional Density and Security\, and (4) Dis ruptive Defense Microsystem Applications. Each of these overlapping spaces present significant opportunities for exploring new and creative technolo gies.\n\nAreas of Interest:\nResearch areas of current interest to MTO inc lude\, but are not limited to\, the following topics:\nAdvanced RF and EO/ IR filters and related front-end components\nAdvanced imaging architecture s and systems\nAdvanced photonic & electronic interconnects\nAtomic physic s\nChip-scale sensors\nCold-atom microsystem component technologies\nCogni tive and other advanced EW technologies\nCompound semiconductor-based elec tronics and other emerging device technologies\nComputational architecture s and algorithms for next generation artificial intelligence (AI)\nDirecte d energy component technologies\, physics of effects\, and protection tech niques\nElectro-optical/infrared (EO/IR) technologies\nElectronics and mic ro sensors for harsh environments\nEnergy-efficient computing and advanced signal processing\nHardware assurance\, reliability & validation\nHeterog eneous integration/assembly technologies (2D\, 2.5D\, and 3D)\nHigh-energy lasers\nHigh power microwave technologies\nLow power electronics\nLow tem perature electronics\nLow volume microsystems manufacturing and assembly\n Materials to enable next-generation microelectronics\nMetrology and manufa cturing tools for multi-chip\, multi-technology packaging\nMicroelectromec hanical system technology\nMicrosystem design & CAD\nMicrosystems for posi tion\, navigation & timing\nMicrosystems for RF/optical transceivers\nMixe d-signal electronics\nMulti-domain\, integrated tools for virtual prototyp ing\nNovel photonic devices\nProcessing techniques for imaging and spectra l recognition\nQuantum devices\nSignal processing algorithms and technique s to reduce hardware requirements\nThermal management of microsystems\nOth er microsystems technology topic areas\n\nDEADLINE:\n\nAbstract Due Date: Abstracts may be submitted on a rolling basis until 1:00PM ET on January 6 \, 2024.\n\nProposal Due Date: Proposals may be submitted on a rolling bas is until 1:00PM ET on March 16\, 2024.\n\nProposers are strongly encourage d to submit an abstract (maximum of 6 pages\, including all figures\, tabl es\, and charts) in advance of a proposal to minimize effort and reduce th e potential expense of preparing an out-of-scope proposal. DARPA will resp ond to abstracts providing feedback and indicating whether\, after prelimi nary review\, there is interest for the proposed work.\n\nELIGIBILITY: EPF L researchers are eligible to participate.\n\nHOW TO APPLY: Abstracts and Full Proposals sent in response to HR001122S0030 shall be submitted via DA RPA’s BAA Website (https://baa.darpa.mil).\n\nFOR FURTHER INFORMATION: P lease refer to the FOA HR001122S0030 and feel free to contact the Research Office or HR001122S0030@darpa.mil for any question or help.\n\n  LOCATION: STATUS:CONFIRMED END:VEVENT END:VCALENDAR