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SUMMARY:U.S. DOD DARPA - Ultra-Wide BandGap Semiconductors (UWBGS)
DTSTART;VALUE=DATE:20231215
DTSTAMP:20260428T004630Z
UID:b284697e927b7a89116d41f0c5f27c257f0db60c3850bb095c609260
CATEGORIES:Call for proposal
DESCRIPTION:Aim:  The Microsystems Technology Office at DARPA seeks innov
 ative proposals to develop foundational ultra-wide bandgap (UWBG) material
 s (substrate\, device layers\, and junctions) and low resistance electrica
 l contacts necessary for realization of devices that enable UWBG applicati
 ons.\nIn particular\, DARPA seeks proposals in the following areas: 1) low
  defect density\, large area (100 mm diameter)\, epi-ready\, UWBG substrat
 es and 2) uniform\, low defect density UWBG device layers with high doping
  efficiency\, abrupt homo- and/or hetero-junctions with low junction defec
 t density (1012/cm2)\, and ultra-low resistance electrical contacts (2 x 1
 0-6 ohm-cm2).\n\nProposed research should investigate innovative approache
 s that enable revolutionary dvances in materials\, devices\, circuits\, an
 d systems. Specifically excluded is research that primarily results in evo
 lutionary improvements to the existing state of practice.\n\nAmount: Multi
 ple awards are anticipated. The amount of resources made available under t
 his BAA will depend on the quality of the proposals received and the avail
 ability of funds.\n\nDuration: UWBGS is a 36-month\, two-phase program wit
 h a 24-month Phase 1 (base) and 12-month Phase 2 (option).\n\nDeadline: \n
 \n	Proposers Day: October 5\, 2023\n	Abstract (4 pages) Due Date: November
  1\, 2023\n	FAQ Submission Deadline: December 4\, 2023\n	Proposal Due Date
 : December 15\, 2023\n	Estimated period of performance start: July 2024\n\
 nEligibility / Restrictions: Non-U.S. organizations such as EPFL are eligi
 ble\n\nHow to Apply:\n\n\n	Funder Website: https://www.darpa.mil/about-us/
 offices/mto.\n	Link to call: https://www.grants.gov/web/grants/view-opport
 unity.html?oppId=350399\n	Application portal link: All abstracts sent in r
 esponse to HR001123S0051 shall be submitted via DARPA's BAA Website (https
 ://baa.darpa.mil )\, full proposals should be submitted using www.grants.g
 ov.\n	Other relevant information\n\nFor Further Info: \n\n\n	All administr
 ative correspondence and questions on this solicitation\, including reques
 ts for clarifying information on how to submit an abstract or full proposa
 l to this BAA should be directed to HR001123S0051@darpa.mil .\n	DARPA will
  post a consolidated Question and Answer (FAQ) document on a regular basis
 . To access the posting go to: http://www.darpa.mil/work-with-us/opportuni
 ties . Under the HR001123S0051 summary will be a link to the FAQ. Submit y
 our question/s by e-mail to HR001123S0051@darpa.mil.\n\nPlease contact the
  ReO for more information: Research Office
LOCATION:
STATUS:CONFIRMED
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