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SUMMARY:IC Colloquium: Embedded Security: An Ongoing Challenge for Healthc
 are
DTSTART:20231211T161500
DTEND:20231211T173000
DTSTAMP:20260406T230151Z
UID:bfa5cac0ec50716cf9836c9ff714cdad2ff0a185e824fa1a1d7122bf
CATEGORIES:Conferences - Seminars
DESCRIPTION:By : Wayne Burleson - University of Massachusetts Amherst\nVid
 eo of his talk\n\nAbstract\nSmart healthcare technology has enormous poten
 tial to improve patient outcomes\, reduce health inequity\, and reduce cos
 ts. Internet-connected (IoT) medical devices such as pacemakers\, insulin 
 pumps\, bio-sensors and neuro-stimulators make it possible to monitor heal
 th and deliver personalized care anywhere. However\, security\, privacy\, 
 and trust issues loom due to human health and safety and also personal hea
 lth data at risk. There is a pressing need for embedded security solutions
 \, not only for healthcare IoT\, but also for other critical technological
  aspects of modern life—from autonomous vehicles\, to power distribution
 \, to smart homes.   This talk will show threats across software and har
 dware levels\, and review recent security solutions and open problems.\n\n
 Bio\nWayne Burleson has been a Professor of Electrical and Computer Engine
 ering at the University of Massachusetts Amherst since 1990 and is current
 ly on sabbatical at EPFL. From 2012-2017\, he was a Senior Fellow at AMD R
 esearch on a team that led to the most powerful and green supercomputers i
 n the world.  He has also had previous sabbaticals at EPFL\, LIRM Montpel
 ier and Telecom Paris.   He has EE degrees from MIT and the University o
 f Colorado. He has worked as a custom chip designer and consultant in the 
 semiconductor industry with VLSI Technology\, DEC\, Compaq/HP\, Intel\, Ra
 mbus and AMD\, as well as several start-ups. His research is in the genera
 l area of Security Engineering and VLSI\, including medical devices\, RFID
 \, lightweight security\, post-CMOS circuits and CAD for low-power\, inter
 connects\, clocking\, reliability\, thermal effects\, process variation an
 d noise mitigation.  Wayne has published over 200 refereed publications i
 n these areas and is a Fellow of the IEEE for contributions in integrated 
 circuit design and signal processing.\n\nMore information
LOCATION:BC 420 https://plan.epfl.ch/?room==BC%20420 https://epfl.zoom.us/
 j/65343938701
STATUS:CONFIRMED
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