BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//Memento EPFL//
BEGIN:VEVENT
SUMMARY:Self-assembly and stacking of thin chips at an air-water interface
DTSTART:20130613T161500
DTEND:20130613T171500
DTSTAMP:20260916T050040Z
UID:a54961b55c0c618362b31e0c4a04d17b989ad958b8facc2a08037ffb
CATEGORIES:Conferences - Seminars
DESCRIPTION:Prof. Karl F. Boehringer\, Department of Electrical Engineerin
 g\, University of Washington\nBio: Karl Boehringer is Professor of Electri
 cal Engineering and Bioengineering\, Director of the College of Engineerin
 g Microfabrication Facility\, and Site Director for the National Nanotechn
 ology Infrastructure Network at the University of Washington. He received 
 his Diplom-Informatiker degree from the University of Karlsruhe\, Germany 
 and both his M.S. and Ph.D. degrees in Computer Science from Cornell Unive
 rsity. He was a visiting scholar at the Stanford Robotics Lab and Transduc
 er Lab and a postdoctoral researcher at the University of California\, Ber
 keley\, before joining the faculty at the University of Washington. He rec
 eived an NSF postdoctoral associateship in 1997 and an NSF CAREER award in
  1999. His work was featured among the Top 100 Science Stories in Discover
  Magazine's 2002 "Year in Science". In 2004\, he received the IEEE Robotic
 s and Automation Society Academic Early Career Award and a sabbatical fell
 owship from the Japan Society for the Promotion of Science (JSPS). Since 2
 010\, he holds the John M. Fluke Distinguished Chair in Engineering at the
  University of Washington. He is a member of the editorial board of the AS
 ME/IEEE Journal of Microelectromechanical Systems and the IEEE Transaction
 s on Automation Science and Engineering. He was co-chair of the 2011 IEEE 
 International Conference on Microelectromechanical Systems.\nSelf-assembly
  is the spontaneous and reversible organization of components into ordered
  structures\, offering an alternative to conventional pick-and-place assem
 bly of heterogeneous microsystems\, which are currently experiencing an ex
 plosive growth in volume and diversity especially for portable and wireles
 s applications. This talk starts with an overview of two decades of micro-
 scale self-assembly before discussing a recently developed technique for a
 ssembly and stacking of very thin components. In this approach\, silicon c
 hips are aligned onto a substrate that passes through an air-water interfa
 ce\, lending itself to roll-to-roll manufacturing. Experiments and modelin
 g demonstrate high assembly yield\, which is always of concern for such in
 herently stochastic manufacturing processes. This model also provides an e
 xplanation for the 'graceful' degradation of yield as process parameters b
 ecome less favorable.
LOCATION:CM1106 http://plan.epfl.ch/?lang=fr&room=CM1106
STATUS:CONFIRMED
END:VEVENT
END:VCALENDAR