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SUMMARY:Nanoscale Offset Printing Platform for Sensors\, Electronics\, Ene
 rgy and Material Applications
DTSTART:20130822T143000
DTEND:20130822T153000
DTSTAMP:20260414T224457Z
UID:afb89481e613650d3ad56008b54f7486abda927813ca54a1f59935d9
CATEGORIES:Conferences - Seminars
DESCRIPTION:Prof. Ahmed A. Busnaina\, Northeastern University\, Boston\, M
 A (USA)\nBio: Ahmed A. Busnaina\, Ph.D. is the William Lincoln Smith Chair
  Professor and Director of National Science Foundation’s Nanoscale Scien
 ce and Engineering Center (NSEC) for High-rate Nanomanufacturing (CHN) at 
 Northeastern University\, Boston\, MA. He is internationally recognized fo
 r his work on nano and micro scale defect (particulate and chemical) mitig
 ation and removal in semiconductor fabrication. He also involved in the fa
 brication of nano-scale wires\, structures and interconnects. He specializ
 es in directed assembly of nanoelements and in the fabrication of micro an
 d nanoscale structures. He served as a consultant on micro contamination a
 nd particle adhesion issues to the semiconductor industry. He has authored
  more than 500 papers in journals\, proceedings and conferences. His resea
 rch support exceeds 47 million dollars. He is on the editorial advisory bo
 ard of Semiconductor International\, the Journal of Particulate Science an
 d Technology. He is a fellow of the American Society of Mechanical Enginee
 rs\, and the Adhesion Society\, a Fulbright Senior Scholar and listed in W
 ho's Who in the World\, in America\, in science and engineering. He was aw
 arded the 2006 Nanotech Briefs National Nano50 Award\, Innovator category\
 , the 2006 Outstanding Faculty Research Award\, Northeastern University 20
 06\, the 2005 Aspiration Award\, Northeastern University.\nThe NSF Center 
 for High-rate Nanomanufacturing (CHN) has developed a novel reconfigurable
  manufacturing technology (Nanoscale Offset Printing) platform that operat
 es at ambient temperature and pressure\, is water-based\, material-indepen
 dent and low energy\, and requires small capital investment. It has been u
 sed to make structures and devices across length scales. The center has de
 veloped templates with nanoscale features to assemble and print structures
  down to 20 nm in a short time and over a large area. Recently\, a rapid a
 nd scalable manufacturing process for 3D nanoscale features was developed 
 to fabricate interconnects and plasmonic devices using nanoparticles. Nonv
 olatile memory switches using CNTs or molecules assembled at wafer level i
 s one application. Another application is a new biosensor chip (0.02 mm2) 
 capable of simultaneously detecting multiple biomarkers. The biosensor can
  be in vitro or in vivo with a detection limit that is 200 times lower tha
 n current technology. The center also developed several CNT and MoS2 based
  electronic devices. The center develops the fundamental science and engin
 eering necessary to manufacture a wide array of applications ranging from 
 electronics\, energy\, sensors and materials to biotechnology. A directed 
 assembly-based nanomanufacturing factory could be built for as low as $50 
 million\, a fraction of today’s cost\, making nanotechnology accessible 
 to millions of new innovators and entrepreneurs and unleashing a wave of c
 reativity in the same way as the advent of the PC did for computing.
LOCATION:SV1717a http://map.epfl.ch/?room=sv1717a
STATUS:CONFIRMED
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