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VERSION:2.0
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SUMMARY:Enabling Capillary Self-Assembly for Microsystem Integration
DTSTART:20100318T143000
DTSTAMP:20260407T043315Z
UID:21fed30bb9e7308acabf0d67ad61bacea2a4ddbbca17287fdecc3ef7
CATEGORIES:Conferences - Seminars
DESCRIPTION:Massimo Mastrangeli\, Katholieke Universiteit Leuven and IMEC 
 (Leuven\, BE)\nThe integration of multifunctional microsystems is a leadin
 g trend in current micro- and nanoelectronics. Particularly\, in the persp
 ective of efficiently assembling huge amounts of very-small devices onto s
 tandalone structures\, robotic pick-and-place in spite of its dexterity is
  not optimal due to seriality and handling issues. On the contrary\, self-
 assembly methods are massively parallel and nonprehensile but needs to be 
 directed. The convergence of the both approaches\, as embodied by capillar
 y flip-chip assembly\, can therefore ideally address most of near-term ele
 ctronic packaging needs. Capillary self-assembly will be the subject of my
  seminar. After a brief prelude on general\nprinciples of self-assembly [1
 ]\, I will define the capillary part-on-drop system that I studied in my P
 hD activity. I will then expose several related issues – e.g. experiment
 al measurement of lateral capillary forces\, finite-element and agent-base
 d modeling of capillary self-assembly\, selective dip-coating of patterned
  substrates\, establishment of solder interconnects - that I addressed bot
 h theoretically and experimentally in my work\, with the aim of bridging t
 he gap between proof-of-concepts and industrial application of this promis
 ing packaging technique.\n\n[1] M. Mastrangeli\, S. Abbasi\, C. Varel\, C.
  Van Hoof. J.-P. Celis and K. F. Böhringer\, “Self-Assembly from Milli-
  to Nanoscales: Methods and Applications”\, J. Micromech. Microeng. 19 (
 2009)\, 083001\n\nMM (’81) is PhD candidate at Katholieke Universiteit L
 euven and IMEC (Leuven\, BE)\, working on capillary self-assembly for micr
 oelectronic packaging. He got his B. S. and M. S. degrees in Electronic En
 gineering at the University of Pisa (Pisa\, IT) in 2003 and 2005\, respect
 ively\, specializing in the design and characterization of microelectromec
 hanical resonators. During his current appointment\, he was Visiting Schol
 ar at the Electrical Engineering Dept. of the University of Washington (Se
 attle\, USA)\, the Santa Fe Institute (Santa Fe\, USA) and BEAMS Dept. of 
 the Universite’ Libre de Bruxelles (Bruxelles\, BE). His main interests 
 span from complexity and music to sport and satire.
LOCATION:Bm 5.202
STATUS:CONFIRMED
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