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SUMMARY:Thermal Sensing and Management
DTSTART:20090527T173000
DTSTAMP:20260502T075311Z
UID:ed074ccc3f9513f430b9ebae5fcc43ad14579c25eeeafb6b2d430bae
CATEGORIES:Conferences - Seminars
DESCRIPTION:Prof.  Wayne Burleson\nThermal issues are an increasing concer
 n in semiconductors\, from microprocessors to memories\, analog circuits a
 nd ASICs. This presentation provides an overview of the challenges involve
 d in sensing on-chip temperature and some new techniques for managing temp
 erature. The sensing problem includes modeling thermal behavior of MOSFETs
  and interconnects and then designing sensing circuits which are low-cost 
 yet robust to variations in process and voltage.  Calibration and intercon
 nection of widely spread sensors are critical to responsive thermal manage
 ment. A novel Monitor Network on Chip (MNOC) is proposed with performance 
 studies for both thermal and delay monitors.  Results indicate significant
  improvement in thermal and power management due to the reduced latency of
  MNOC. Novel approaches to thermal modeling\, simulation and management ar
 e also presented. This work has been supported by SRC\, Intel\, AMD\, Cade
 nce and the National Science Foundation.
LOCATION:INM 200
STATUS:CONFIRMED
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