BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//Memento EPFL//
BEGIN:VEVENT
SUMMARY:Wafer level 3D Integration: From packaging miniaturisation to adva
 nced IC
DTSTART:20090428T140000
DTSTAMP:20260408T133345Z
UID:700253e7f104060a3962f007b0a84372ac6290802118cb7593bafaf6
CATEGORIES:Conferences - Seminars
DESCRIPTION:Speaker: Dr. Nicolas Sillon\, Group Manager Packaging and Inte
 gration\, CEA-Leti Minatec\n
LOCATION:INF328
STATUS:CONFIRMED
END:VEVENT
END:VCALENDAR