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SUMMARY:Packaging and hybridization\, the valorization of MEMS technologie
 s
DTSTART:20170511T111500
DTEND:20170511T120000
DTSTAMP:20260405T164836Z
UID:4e1807a1cbf4e33ffc4e560f3943e0984b64fffd16be5a21fa281883
CATEGORIES:Conferences - Seminars
DESCRIPTION:Dr. Michel Despont\nAbstract: The integration of microsystems 
 and\, in particular\, of MEMS devices continues to be a key element of man
 y high technology application areas. If the devices themselves are crucial
  elements for innovation\, their integration in a complete microsystem are
  essential for their successful commercialization. Hence development of 3D
  integration and packaging technologies are of the upmost importance. At C
 SEM we develop new solutions for wafer level hybridization and packaging s
 olutions to respond to the demand of the industry active in microsystem te
 chnology. An overview of the packaging and hybridization technology will b
 e presented along with some concrete examples such are biocompatible herme
 tic packaging for active implant\, wafer level gas cell for atomic clock\,
  wafer level hybridization for complex micromechanical components\, hetero
 geneous integration of microdevices at wafer level\, MEMS integration on s
 oft micromodule.  \n\nBio: Dr. Michel Despont received a Ph.D. in physic
 s from the Institute of Microtechnology\, University of Neuchatel\, Switze
 rland\, in 1996. After a postdoctoral fellowship at the IBM Research - Zur
 ich laboratory in 1996\, he spent one year as a visiting scientist at the 
 Seiko Instrument Research Laboratory in Japan. In 2005\, he was appointed 
 manager and led the nanofabrication group at IBM Research – Zurich Labor
 atory. Since 2013\, Dr Despont is currently employed by the Swiss Centre o
 f Electronics and Microtechnology (CSEM) as Vice-President of the MEMS pro
 gram and manager of the Emerging Micro&Nano Technologies section in the Mi
 cro&Nano Systems division.\n 
LOCATION:DIA005 https://plan.epfl.ch/?room=DIA005
STATUS:CONFIRMED
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