BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//Memento EPFL//
BEGIN:VEVENT
SUMMARY:The role of interfacial diffusion in the creep of Ni superalloys
DTSTART:20170710T140000
DTEND:20170710T153000
DTSTAMP:20260916T044028Z
UID:10169025aaaa720c24756368219607d5324c3bc85ff5aa20a3b81790
CATEGORIES:Conferences - Seminars
DESCRIPTION:Prof. Vikram Deshpande\, Cambridge University Department of En
 gineering\, UK.\nI will begin by giving a very brief overview of some of m
 y current research interests in mechanics & materials which include:\n(i) 
 mechanics of composites\, especially 3D composites\;\n(ii) granular media\
 ; (iii) ceramics and cermets\;\n(iv) micro-architectured materials and\n(v
 ) cell mechanics.\nThe bulk of the seminar will focus on recent work on di
 screte dislocation modelling of the creep of Ni superalloys with an emphas
 is on the role of interfacial diffusion at the y / y' interfaces.\n\nFirst
  a methodology for modelling the climb-enabled glide motion of dislocation
 s coupled to vacancy diffusion will be presented. This includes a framewor
 k to investigate the inter-diffusion of Al in Ni3Al at the y / y' interfac
 es driven mainly by the dislocation stress fields. The modelling scheme\, 
 combined with a temporal scaling algorithm\, allows the modelling of the c
 reep of these alloys on realistic time scales (i.e. on the order of 1000 h
 ours). The experimentally observed continuously increasing creep strain ra
 te of Ni superalloys is shown to be an outcome of this discrete dislocatio
 n model with interfacial diffusion playing a critical role. In particular\
 , consistent with observations\, the model predicts that interfacial diffu
 sion results in the formation of wavy interfaces.\n\nThis in turn initiate
 s the formation of dislocation cell structures in the [endif]--> phase an
 d consequent softening of the alloy. The calculations demonstrate the crit
 ical role of interfacial diffusion in controlling the creep rates of Ni su
 peralloys and give insight into the role heavy elements such that Re that 
 reduce creep rates by segregating to the y / y' interfaces.\n\nBio:\nProf.
  Vikram Deshpande joined the faculty of Engineering at the University of C
 ambridge as a lecturer in October 2001 and was promoted to a professorship
  in Materials Engineering in 2010. He holds a Visiting Professorship at Ei
 ndhoven University Mechanical Engineering Department\, The Netherlands. He
  was a tenured Associate Professor at the University of California\, Santa
  Barbara (UCSB) in 2007-2008\, and has written in excess of 200 journal ar
 ticles in the experimental and theoretical mechanics solid mechanics with 
 an h-index of 58. He serves on the editorial boards of a number of journal
 s in mechanics and biomechanics including Journal of the Mechanics and Phy
 sics of Solids\, Molecular and Cellular Biomechanics and Modelling and Sim
 ulation in Materials Science and Engineering.
LOCATION:MED 0 1418 https://plan.epfl.ch/?room==MED%200%201418
STATUS:CONFIRMED
END:VEVENT
END:VCALENDAR