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SUMMARY:Miniaturized Implants to Interface with the Peripheral and Central
  Nervous System
DTSTART:20171026T161500
DTEND:20171026T180000
DTSTAMP:20260407T175833Z
UID:bc8297a9f64781966786f07d6edc4cbb7b9c74336d4ebaab6d1c61d2
CATEGORIES:Conferences - Seminars
DESCRIPTION:Prof. Thomas Stieglitz\, IMTEK - Institut für Mikrosystemtech
 nik\, University of Freiburg (D)\nCENTER FOR NEUROPROSTHETICS (CNP) SEMINA
 R\n\nAbstract:\nNeural implants need to establish stable and reliable inte
 rfaces to the target structure for chronic application in neurosciences as
  well as in clinical applications. They have to record electrical neural s
 ignals\, excite neural cells or fibers by means of electrical stimulation.
  In case of optogenetic experiments\, optical stimulation by integrated li
 ght sources or waveguides must be integrated on implants. Metabolic monito
 ring and detection of neurotransmitter concentrations is also part of the 
 research agenda but not yet mature enough for translation in chronic clini
 cal applications. Proper selection of substrate\, insulation and electrode
  materials is of utmost importance to bring the interface in close contact
  with the neural target structures\, minimize foreign body reaction after 
 implantation and maintain functionality over the complete implantation per
 iod.\n\nOur work has focused on polymer substrates with integrated thin-fi
 lm metallization as core of our flexible neural interfaces approach and si
 licone rubber with metal sheets. Micromachining and laser structuring are 
 the main technologies for electrode array manufacturing. Designing applica
 tions for implants in the peripheral and central nervous system needs inte
 gration of components\, the connection of cables and connectors to both\, 
 electrode arrays and hermetic packages containing electronic circuitry for
  recording\, stimulation and signal processing. Failure of one of the comp
 onents or connections stops the function of the whole system.\n\nWe presen
 t an exemplary implant system and discuss state of the art materials and m
 anufacturing techniques as well as prominent failure modes. Thin-film subs
 trates and hybrid combinations with silicone rubber substrates serve as ne
 ural interfaces. Adhesion layers have been integrated to obtain long term 
 stability of polyimide-platinum sandwiches. Hermetic packages with dozens 
 of electrical feed-throughs need novel approaches to meet the desire of im
 plants with hundreds of electrode channels. Reliability data from long-ter
 m ageing studies and chronic experiments show the applicability of thin-fi
 lm implants for stimulation and recording and ceramic packages for electro
 nics protection. However\, system assembly and interfacing microsystems to
  robust cables and connectors still is a major challenge in translational 
 research and transition of research results into medical products.\n \nBi
 o:\nThomas Stieglitz (M’95–SM’09) received a Diploma degree in elect
 rical Engineering from Technische Hochschule Karlsruhe\, Germany\, in 1993
 \, and a PhD and rehabilitation degree in 1998 and 2003 from the Universit
 y of Saarland\, Germany\, respectively. In 1993\, he joined the Fraunhofer
  Institute for Biomedical Engineering in St. Ingbert\, Germany\, where he 
 established the Neural Prosthetics Group. Since 2004\, he is a full profes
 sor for Biomedical Microtechnology at the Albert-Ludwig-University Freibur
 g\, Germany\, in the Department of Microsystems Engineering (IMTEK) at the
  Faculty of Engineering. He serves as board member and deputy speaker of t
 he Research Cluster of Excellence “BrainLinks-BrainTools”. His researc
 h interests include neural interfaces and implants\, biocompatible assembl
 ing and packaging and brain machine interfaces.\n\nDr. Stieglitz has co-au
 thored about 100 peer reviewed journal publications\, 300 conference proce
 edings and holds 18 patents. He is co-founder and scientific consultant of
  CorTec GmbH and neuroloop GmbH\, two spin-off companies which focus on ne
 ural implant technology and neuromodulation\, respectively. Dr. Stieglitz 
 is member of the IEEE EMBS\, SfN\, the Materials Research Society\, foundi
 ng member of the International Functional Electrical Stimulation Society (
 IFESS) and member of the German Biomedical Engineering Society (DGBMT im V
 DE) where he is chair of the Neural Prostheses and Intelligent Implants se
 ction.
LOCATION:CE 1 2 https://plan.epfl.ch/?room==CE%201%202
STATUS:CONFIRMED
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