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SUMMARY:Piezoelectric Micromachined Ultrasonic Transducers for Consumer De
 vices
DTSTART:20180409T101500
DTEND:20180409T110000
DTSTAMP:20260404T133252Z
UID:95f8b2d4990f1ad951425909a30689cbbc5555a3286b4875c7d174f6
CATEGORIES:Conferences - Seminars
DESCRIPTION:Prof. Dr. David Horsley\, University of California\, Davis\nIn
 stitute of Microengineering - Distinguished Lecture\n\nAbstract: Micromach
 ined ultrasonic transducers (MUTs) are best known for their use in medical
  imaging\, a field where imaging performance dominates over features such 
 as transducer size\, weight\, power consumption and cost. In comparison\, 
 these features are the main drivers for the success of the MEMS sensors us
 ed in consumer electronics and automotive applications\, such as pressure 
 sensors\, accelerometers\, gyroscopes\, and microphones. These MEMS sensor
 s replaced their conventional counterparts in existing applications and\, 
 more important\, enabled novel and unexpected applications (such as smart 
 phones\, toys\, fitness trackers\, etc.) where low cost\, small size\, lig
 ht weight\, and ultra-low power consumption are critical.\nIn this talk\, 
 I will describe MEMS ultrasonic sensors based on piezoelectric MUTs (PMUTs
 ) intended for consumer electronics applications such as range-finding and
  fingerprint sensing. A common characteristic of these applications is tha
 t they require manufacturing at high volume with relatively low cost. We h
 ave developed air-coupled ultrasonic sensors based on PMUTs that operate a
 t 15 microwatts. Relative to optical sensors\, these ultrasonic sensors ha
 ve the advantage of very low power consumption and long range (> 1 m). In 
 related research\, we demonstrated a 500 DPI ultrasonic fingerprint sensor
  that has similar resolution to Apple’s TouchID sensor but the added adv
 antages that it is capable of imaging wet or oily fingers and can image th
 e dermis beneath the surface of the finger.\n\nBio: David A. Horsley recei
 ved his PhD in Mechanical Engineering from the University of California\, 
 Berkeley\, in 1998. He is co-founder and CTO of Chirp Microsystems Inc.\, 
 a manufacturer of ultrasonic sensors using MEMS technology. Dr. Horsley is
  also a Professor of Mechanical and Aerospace Engineering at the Universit
 y of California\, Davis\, and Adjunct Professor of Mechanical Engineering 
 at the University of California\, Berkeley. Since 2004\, he has been Co-Di
 rector of the Berkeley Sensor and Actuator Center (BSAC)\, the National Sc
 ience Foundation’s Industrial/University Collaborative Research Center (
 I/UCRC) focused on MEMS research. Dr. Horsley was Co-Chair of the 2016 IEE
 E Sensors Conference\, Co-Chair of the 2017 Transducers Research Foundatio
 n Napa Microsystems Workshop\, and he is the Co-Chair of the 2020 IEEE MEM
 S Conference. Dr. Horsley is a recipient of the National Science Foundatio
 n’s CAREER Award\, the Outstanding Junior Faculty Award at UC Davis\, th
 e 2016 NSF I/UCRC Association’s Schwarzkopf Award for Technological Inno
 vation\, and has authored or co-authored over 150 scientific papers and ho
 lds over 20 patents
LOCATION:SV 1717 https://plan.epfl.ch/?room==SV%201717
STATUS:CONFIRMED
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