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SUMMARY:Packaging and Hybridization: the Valorization of MEMS Technologies
DTSTART:20180508T111500
DTEND:20180508T120000
DTSTAMP:20260408T101653Z
UID:f7345781afb9facdda0652920d059a48bf3cea1eb4366c5e3c5c6edd
CATEGORIES:Conferences - Seminars
DESCRIPTION:Dr. Michel Despont\nAbstract: The integration of microsystems 
 and\, in particular\, of MEMS devices continues to be a key element of man
 y high technology application areas. If the devices themselves are crucial
  elements for innovation\, their integration in a complete microsystem are
  essential for their successful commercialization. Hence development of 3D
  integration and packaging technologies are of the upmost importance. At C
 SEM we develop new solutions for wafer level hybridization and packaging s
 olutions to respond to the demand of the industry active in microsystem te
 chnology. An overview of the packaging and hybridization technology will b
 e presented along with some concrete examples such are biocompatible herme
 tic packaging for active implant\, wafer level gas cell for atomic clock\,
  wafer level hybridization for complex micromechanical components\, hetero
 geneous integration of microdevices at wafer level\, MEMS integration on s
 oft micromodule.   \n\nBio: Dr. Michel Despont received a Ph.D. in physi
 cs from the Institute of Microtechnology\, University of Neuchatel\, Switz
 erland\, in 1996. After a postdoctoral fellowship at the IBM Research - Zu
 rich laboratory in 1996\, he spent one year as a visiting scientist at the
  Seiko Instrument Research Laboratory in Japan. In 2005\, he was appointed
  manager and led the nanofabrication group at IBM Research – Zurich Labo
 ratory. Since 2013\, Dr Despont is currently employed by the Swiss Centre 
 of Electronics and Microtechnology (CSEM) as Vice-President of the MEMS pr
 ogram and manager of the Emerging Micro&Nano Technologies section in the M
 icro&Nano Systems division.\n\nCSEM Website.\n\nThis seminar is part of th
 e Master's class MICRO534\, Advanced MEMS and Microsystems\, and is open t
 o the informed public.
LOCATION:DIA 005 https://plan.epfl.ch/?room=DIA005
STATUS:CONFIRMED
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