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SUMMARY:MechE Colloquium: Mechanics-guided\, deterministic 3D assembly
DTSTART:20190326T121500
DTEND:20190326T131500
DTSTAMP:20260407T102813Z
UID:c9d14af204d07115a7ed448d308d4b21c4f8dc6b21788d6b7a8d5b68
CATEGORIES:Conferences - Seminars
DESCRIPTION:Prof. Yonggang Huang\, Northwestern University\nAbstract:\nCom
 plex three-dimensional (3D) structures in biology (e.g.\, cytoskeletal web
 s\, neural circuits\, and vasculature networks) form naturally to provide 
 essential functions in even the most basic forms of life.  Compelling opp
 ortunities exist for analogous 3D architectures in human-made devices\, bu
 t design options are constrained by existing capabilities in materials gro
 wth and assembly.  We report routes to previously inaccessible classes of
  3D constructs in advanced materials\, including device-grade silicon [1].
   The schemes involve geometric transformation of 2D micro/nanostructures
  into extended 3D layouts by compressive buckling.  Designs inspired by k
 irigami/origami [2\,3] and/or releasable multilayers [4] enable the format
 ion of mesostructures with a broad variety of 3D geometries\, either with 
 hollow or dense distributions.  Demonstrations include experimental and t
 heoretical studies of more than 100 representative geometries\, from singl
 e and multiple helices\, toroids\, and conical spirals to structures that 
 resemble spherical baskets\, cars\, houses\, cuboid cages\, starbursts\, f
 lowers\, scaffolds\, each with single- and/or multiple-level configuration
 s.  Morphable 3D mesostructures whoese geometries can be elastically alte
 red can be further achieved via nonlinear mechanical buckling\, by deformi
 ng the elastomer platforms in different time sequences [5].  We further i
 ntroduce concepts in physical transfer\, patterned photopolymerization and
  non-linear plasticity to enable integration of 3D mesostructures onto nea
 rly any class of substrate\, with additional capabilities in access to ful
 ly or partially free-standing forms\, all via mechanisms quantitatively de
 scribed by theoretical modeling [6].  Compatibility with the well-establi
 shed technologies available in semiconductor industries suggests a broad r
 ange of application opportunities [7].  Illustrations of these ideas incl
 ude their use in building 3D structures as radio frequency devices for ada
 ptive electromagnetic properties [5]\, as open-architecture electronic sca
 ffolds for formation of dorsal root ganglion (DRG) neural networks [6]\, a
 s ultra-stretchable interconnects for soft electronics [8] and as catalyst
  supports for propulsive systems in 3D micro-swimmers with geometrically c
 ontrolled dynamics [6].\n\nReferences\n[1]          Xu S et al.\
 , 2015. Assembly of micro/nanomaterials into complex\, three-dimensional a
 rchitectures by compressive buckling. Science\, 347\, pp.154-159.\n[2]  
         Zhang Y et al.\, 2015. A mechanically driven form of Kiriga
 mi as a route to 3D mesostructures in micro/nanomembranes. PNAS\, 112\, pp
 .11757-11764.\n[3]          Yan Z et al.\, 2016. Controlled mecha
 nical buckling for origami-inspired construction of 3D micro/nanostructure
 s in advanced materials. Advanced Functional Materials\, 26\, pp.2629-2639
 .\n[4]          Yan Z et al.\, 2016. Mechanically guided assembly
  of complex\, 3D mesostructures from releasable multilayers of advanced ma
 terials. Science Advances\, 2\, pp.e1601014.\n[5]          Fu H e
 t al.\, 2018. Morphable 3D Mesostructures and Microelectronic Devices by M
 ultistable Buckling Mechanics. Nature Materials\, 17\, pp. 268-276.\n[6] 
          Yan Z et al.\, 2017. Mechanically guided assembly of comp
 lex\, 3D mesostructures from releasable multilayers of advanced materials.
  PNAS\, 114\, pp. E9455-E9464.\n[7]          Zhang Y et al.\, 201
 7. Printing\, Folding and assembly methods for forming 3D mesostructures i
 n advanced materials. Nature Reviews Materials\, 2\, pp. 17019.\n[8]   
        Jang KI et al.\, 2017. Self-Assembled\, Three Dimensional Net
 work Designs of Soft Electronics. Nature Communications\, 8\, 15894.\n\nBi
 o:\nYonggang Huang is the Murphy Professor of Mechanical Engineering\, Civ
 il and Environmental Engineering\, and Materials Science and Engineering a
 t Northwestern University.  He is interested in mechanics of stretchable 
 and flexible electronics\, and mechanically guided deterministic 3D assemb
 ly.  He has published >500 journal papers\, including 10 in Science and 4
  in Nature.  He is a member of the US National Academy of Engineering\, a
  member of European Academy of Sciences and Arts\, a foreign member of Aca
 demia Europaea\, and a foreign member of Chinese Academy of Sciences.  Hi
 s recent research awards include the Larson Award (2003)\, Melville Medal 
 (2004)\, Richards Award (2010)\, Drucker Medal (2013)\, and Nadai Medal (2
 016) from the American Society of Mechanical Engineers (ASME)\; Young Inve
 stigator Medal (2006) and Prager Medal (2017) from the Society of Engineer
 ing Sciences\; International Journal of Plasticity Medal (2007)\; Guggenhe
 im Fellowship from the John Simon Guggenheim Foundation (2008)\; Highly Ci
 ted Researcher in Engineering  (2009)\, Materials Science (since 2014) an
 d Physics (since 2018)\, and Bazant Medal from the American Society of Civ
 il Engineers (2018).  He has received awards for teaching and undergradua
 te advising from University of Arizona (1993)\; University of Illinois at 
 Urbana-Champaign (2003\, 2004\, 2005\, 2006\, 2007)\; and Northwestern Uni
 versity (2016\, 2018).
LOCATION:MED 0 1418 https://plan.epfl.ch/?room==MED%200%201418
STATUS:CONFIRMED
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