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SUMMARY:Packaging and Hybridization: the Valorization of MEMS Technologies
DTSTART:20190514T121500
DTEND:20190514T130000
DTSTAMP:20260509T100750Z
UID:c3af6f31964c9684e729192b06cb364c7a894f91caacb8d27f763193
CATEGORIES:Conferences - Seminars
DESCRIPTION:Dr. Michel Despont\nAbstract: The integration of microsystems 
 and\, in particular\, of MEMS devices continues to be a key element of man
 y high technology application areas. If the devices themselves are crucial
  elements for innovation\, their integration in a complete microsystem are
  essential for their successful commercialization. Hence development of 3D
  integration and packaging technologies are of the upmost importance. At C
 SEM we develop new solutions for wafer level hybridization and packaging s
 olutions to respond to the demand of the industry active in microsystem te
 chnology. An overview of the packaging and hybridization technology will b
 e presented along with some concrete examples such are biocompatible herme
 tic packaging for active implant\, wafer level gas cell for atomic clock\,
  wafer level hybridization for complex micromechanical components\, hetero
 geneous integration of microdevices at wafer level\, MEMS integration on s
 oft micromodule.\n\nBio: Dr. Michel Despont received a Ph.D. in physics fr
 om the Institute of Microtechnology\, University of Neuchatel\, Switzerlan
 d\, in 1996. After a postdoctoral fellowship at the IBM Research - Zurich 
 laboratory in 1996\, he spent one year as a visiting scientist at the Seik
 o Instrument Research Laboratory in Japan. In 2005\, he was appointed mana
 ger and led the nanofabrication group at IBM Research – Zurich Laborator
 y. Since 2013\, Dr Despont is currently employed by the Swiss Centre of El
 ectronics and Microtechnology (CSEM) as Vice-President of the MEMS program
  and manager of the Emerging Micro&Nano Technologies section in the Micro&
 Nano Systems division.\n\nCSEM Website.\n\nThis seminar is part of the Mas
 ter's class MICRO534\, Advanced MEMS and Microsystems\, and is open to the
  informed public.
LOCATION:DIA 005 https://plan.epfl.ch/?room=DIA005
STATUS:CONFIRMED
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