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SUMMARY:Substrate Integrated Circuits (SICs) - A paradigm for future GHz a
 nd THz electronic and photonic systems
DTSTART:20120718T101500
DTEND:20120718T110000
DTSTAMP:20260416T015730Z
UID:020fb5f50669b6138234813a58b02b17d6e6bb3e7161d5066fc4c46b
CATEGORIES:Conferences - Seminars
DESCRIPTION:Ke Wu\, Ecole Polytechnique (University of Montreal)\, Canada\
 nWidespread applications and commercial success of future GHz and THz elec
 tronic and photonic devices and systems including RF\, microwaves and mill
 imeter-waves are closely related to their manufacturing cost and circuit i
 ntegration. Our proposed integration technologies of planar and non-planar
  structures as well as related new progress indicate that the emerging sub
 strate integrated circuits (SICs) are able to provide unprecedented advant
 ages for developing low-cost GHz/THz components\, systems and wireless pho
 tonic applications. This talk reviews the state-of-the-art and underlying 
 features of the proposed integration platforms for designing the next gene
 ration RF/millimeter-wave/THz ICs and systems. Challenging issues and futu
 re directions are discussed for research and developments. Potential probl
 ems and possible solutions are also presented. It is believed that the new
 ly proposed concept of SICs will offer a potentially cost-effective and pe
 rformance-promising solution for mass commercial applications. With the de
 velopment of innovative fabrication processes and material synthesis techn
 iques\, unique hybrid and monolithic high-density 3-D integration of plana
 r and non-planar structures (or system-on-substrate approach) become reali
 zable. It can also be demonstrated that this scheme of SICs may be able to
  effectively bridge the gap between electronics and photonics. In this pre
 sentation\, our current research activities and future RF/millimeter-wave 
 research directions will be discussed.
LOCATION:ELD120 http://plan.epfl.ch/?lang=en&room=ELD120
STATUS:CONFIRMED
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