Wafer level 3D Integration: From packaging miniaturisation to advanced IC
Event details
| Date | 28.04.2009 |
| Hour | 14:00 |
| Speaker | Speaker: Dr. Nicolas Sillon, Group Manager Packaging and Integration, CEA-Leti Minatec |
| Location |
INF328
|
| Category | Conferences - Seminars |
Practical information
- General public
- Free