Copper TSV-Based Process Development for Die-Level Homogeneous and Heterogeneous 3D Integration Platform

Event details
Date | 01.12.2017 |
Hour | 17:00 |
Speaker | Seniz Esra KÜÇÜK |
Location | |
Category | Thesis defenses |
Thesis director : Prof. Y. Leblebici
Microsystems and Microelectronics doctoral program.
Thesis 7871
Practical information
- General public
- Free