Copper TSV-Based Process Development for Die-Level Homogeneous and Heterogeneous 3D Integration Platform

Thumbnail

Event details

Date 01.12.2017
Hour 17:00
Speaker Seniz Esra KÜÇÜK
Location
Category Thesis defenses

Thesis director : Prof. Y. Leblebici
Microsystems and Microelectronics doctoral program.
Thesis 7871
 

Practical information

  • General public
  • Free

Tags

EDMI

Event broadcasted in

Share