MechE Seminar: From microelectronics to future aviation: thermal challenges and advanced cooling solutions
Event details
| Date | 14.02.2022 |
| Hour | 09:00 › 10:00 |
| Speaker | Dr. Chiara Falsetti, Oxford Thermofluids Institute, University of Oxford |
| Location | Online |
| Category | Conferences - Seminars |
| Event Language | English |
Abstract: The increasing global energy demand and concerns over environmental impact promoted radical technological changes in a broad swathe of research areas, ranging from electronics, energy conversion systems to the aerospace sector. The overarching goal of these industries is to enhance the system performance and power, while improving the energy eciency and reducing the emissions to avoid irreversible environmental damages and enable the decarbonisation of our economy.
In order to achieve this ambitious objective, one of the main challenges is to manage ever increasing thermal energy fluxes - often in components that must be compact and light. The increasing heat loads and thermal energy generated on board of future aircrafts or in data centers, calls for the development of innovative thermal management systems for heat rejection and recuperation. In fact, the more powerful an IT equipment or an aircraft engine will become, the hotter and less efficient they will get.
Can we design cooling systems exploiting the advantages of evaporative flows and additive manufacturing techniques to significantly reduce the energy consumption, noise level and environmental impact of electronic components, data-centers, as well as aircraft engines?
The present seminar will highlight my past and current research on fundamental heat transfer mechanisms and phase-change phenomena to develop advanced thermal management systems, which have been successfully deployed in very different applications where thermal energy transfer is crucial: from micro-electronics to aerospace.
Bio: Chiara is a postdoctoral researcher at the University of Oxford, working in the Oxford Thermofluids Institute, and a Supernumerary Fellow at Harris Manchester College. Her research interests cover heat transfer, multiphase flows, and optical and thermal measurement techniques.
Chiara completed her PhD at École Polytechnique Fédérale de Lausanne (EPFL), focusing on flow boiling heat transfer and phase-change phenomena for on-chip cooling. Prior to joining Oxford, she was a guest scientist at the Experimental Thermal-Hydraulics Group at Paul Scherrer Institute (PSI), and she was a research intern at Nokia Bell Labs, US.
In order to achieve this ambitious objective, one of the main challenges is to manage ever increasing thermal energy fluxes - often in components that must be compact and light. The increasing heat loads and thermal energy generated on board of future aircrafts or in data centers, calls for the development of innovative thermal management systems for heat rejection and recuperation. In fact, the more powerful an IT equipment or an aircraft engine will become, the hotter and less efficient they will get.
Can we design cooling systems exploiting the advantages of evaporative flows and additive manufacturing techniques to significantly reduce the energy consumption, noise level and environmental impact of electronic components, data-centers, as well as aircraft engines?
The present seminar will highlight my past and current research on fundamental heat transfer mechanisms and phase-change phenomena to develop advanced thermal management systems, which have been successfully deployed in very different applications where thermal energy transfer is crucial: from micro-electronics to aerospace.
Bio: Chiara is a postdoctoral researcher at the University of Oxford, working in the Oxford Thermofluids Institute, and a Supernumerary Fellow at Harris Manchester College. Her research interests cover heat transfer, multiphase flows, and optical and thermal measurement techniques.
Chiara completed her PhD at École Polytechnique Fédérale de Lausanne (EPFL), focusing on flow boiling heat transfer and phase-change phenomena for on-chip cooling. Prior to joining Oxford, she was a guest scientist at the Experimental Thermal-Hydraulics Group at Paul Scherrer Institute (PSI), and she was a research intern at Nokia Bell Labs, US.
Practical information
- General public
- Free