Packaging and Hybridization: the Valorization of MEMS Technologies

Abstract: The integration of microsystems and, in particular, of MEMS devices continues to be a key element of many high technology application areas. If the devices themselves are crucial elements for innovation, their integration in a complete microsystem are essential for their successful commercialization. Hence development of 3D integration and packaging technologies are of the upmost importance. At CSEM we develop new solutions for wafer level hybridization and packaging solutions to respond to the demand of the industry active in microsystem technology. An overview of the packaging and hybridization technology will be presented along with some concrete examples such are biocompatible hermetic packaging for active implant, wafer level gas cell for atomic clock, wafer level hybridization for complex micromechanical components, heterogeneous integration of microdevices at wafer level, MEMS integration on soft micromodule.   

Bio: Dr. Michel Despont received a Ph.D. in physics from the Institute of Microtechnology, University of Neuchatel, Switzerland, in 1996. After a postdoctoral fellowship at the IBM Research - Zurich laboratory in 1996, he spent one year as a visiting scientist at the Seiko Instrument Research Laboratory in Japan. In 2005, he was appointed manager and led the nanofabrication group at IBM Research – Zurich Laboratory. Since 2013, Dr Despont is currently employed by the Swiss Centre of Electronics and Microtechnology (CSEM) as Vice-President of the MEMS program and manager of the Emerging Micro&Nano Technologies section in the Micro&Nano Systems division.

CSEM Website.

This seminar is part of the Master's class MICRO534, Advanced MEMS and Microsystems, and is open to the informed public.