Self-assembly and stacking of thin chips at an air-water interface

Event details

Date	13.06.2013
Hour	16:15 › 17:15
Speaker	Prof. Karl F. Boehringer, Department of Electrical Engineering, University of Washington Bio: Karl Boehringer is Professor of Electrical Engineering and Bioengineering, Director of the College of Engineering Microfabrication Facility, and Site Director for the National Nanotechnology Infrastructure Network at the University of Washington. He received his Diplom-Informatiker degree from the University of Karlsruhe, Germany and both his M.S. and Ph.D. degrees in Computer Science from Cornell University. He was a visiting scholar at the Stanford Robotics Lab and Transducer Lab and a postdoctoral researcher at the University of California, Berkeley, before joining the faculty at the University of Washington. He received an NSF postdoctoral associateship in 1997 and an NSF CAREER award in 1999. His work was featured among the Top 100 Science Stories in Discover Magazine's 2002 "Year in Science". In 2004, he received the IEEE Robotics and Automation Society Academic Early Career Award and a sabbatical fellowship from the Japan Society for the Promotion of Science (JSPS). Since 2010, he holds the John M. Fluke Distinguished Chair in Engineering at the University of Washington. He is a member of the editorial board of the ASME/IEEE Journal of Microelectromechanical Systems and the IEEE Transactions on Automation Science and Engineering. He was co-chair of the 2011 IEEE International Conference on Microelectromechanical Systems.
Location	CM1106
Category	Conferences - Seminars

Self-assembly is the spontaneous and reversible organization of components into ordered structures, offering an alternative to conventional pick-and-place assembly of heterogeneous microsystems, which are currently experiencing an explosive growth in volume and diversity especially for portable and wireless applications. This talk starts with an overview of two decades of micro-scale self-assembly before discussing a recently developed technique for assembly and stacking of very thin components. In this approach, silicon chips are aligned onto a substrate that passes through an air-water interface, lending itself to roll-to-roll manufacturing. Experiments and modeling demonstrate high assembly yield, which is always of concern for such inherently stochastic manufacturing processes. This model also provides an explanation for the 'graceful' degradation of yield as process parameters become less favorable.