Thermal Sensing and Management
Event details
| Date | 27.05.2009 |
| Hour | 17:30 |
| Speaker | Prof. Wayne Burleson |
| Location |
INM 200
|
| Category | Conferences - Seminars |
Thermal issues are an increasing concern in semiconductors, from microprocessors to memories, analog circuits and ASICs. This presentation provides an overview of the challenges involved in sensing on-chip temperature and some new techniques for managing temperature. The sensing problem includes modeling thermal behavior of MOSFETs and interconnects and then designing sensing circuits which are low-cost yet robust to variations in process and voltage. Calibration and interconnection of widely spread sensors are critical to responsive thermal management. A novel Monitor Network on Chip (MNOC) is proposed with performance studies for both thermal and delay monitors. Results indicate significant improvement in thermal and power management due to the reduced latency of MNOC. Novel approaches to thermal modeling, simulation and management are also presented. This work has been supported by SRC, Intel, AMD, Cadence and the National Science Foundation.
Practical information
- General public
- Free