U.S. DOD DARPA - Ultra-Wide BandGap Semiconductors (UWBGS)
Event details
| Date | 15.12.2023 |
| Category | Call for proposal |
Aim: The Microsystems Technology Office at DARPA seeks innovative proposals to develop foundational ultra-wide bandgap (UWBG) materials (substrate, device layers, and junctions) and low resistance electrical contacts necessary for realization of devices that enable UWBG applications.
In particular, DARPA seeks proposals in the following areas: 1) low defect density, large area (100 mm diameter), epi-ready, UWBG substrates and 2) uniform, low defect density UWBG device layers with high doping efficiency, abrupt homo- and/or hetero-junctions with low junction defect density (1012/cm2), and ultra-low resistance electrical contacts (2 x 10-6 ohm-cm2).
Proposed research should investigate innovative approaches that enable revolutionary dvances in materials, devices, circuits, and systems. Specifically excluded is research that primarily results in evolutionary improvements to the existing state of practice.
Amount: Multiple awards are anticipated. The amount of resources made available under this BAA will depend on the quality of the proposals received and the availability of funds.
Duration: UWBGS is a 36-month, two-phase program with a 24-month Phase 1 (base) and 12-month Phase 2 (option).
Deadline:
How to Apply:
In particular, DARPA seeks proposals in the following areas: 1) low defect density, large area (100 mm diameter), epi-ready, UWBG substrates and 2) uniform, low defect density UWBG device layers with high doping efficiency, abrupt homo- and/or hetero-junctions with low junction defect density (1012/cm2), and ultra-low resistance electrical contacts (2 x 10-6 ohm-cm2).
Proposed research should investigate innovative approaches that enable revolutionary dvances in materials, devices, circuits, and systems. Specifically excluded is research that primarily results in evolutionary improvements to the existing state of practice.
Amount: Multiple awards are anticipated. The amount of resources made available under this BAA will depend on the quality of the proposals received and the availability of funds.
Duration: UWBGS is a 36-month, two-phase program with a 24-month Phase 1 (base) and 12-month Phase 2 (option).
Deadline:
- Proposers Day: October 5, 2023
- Abstract (4 pages) Due Date: November 1, 2023
- FAQ Submission Deadline: December 4, 2023
- Proposal Due Date: December 15, 2023
- Estimated period of performance start: July 2024
How to Apply:
- Funder Website: https://www.darpa.mil/about-us/offices/mto.
- Link to call: https://www.grants.gov/web/grants/view-opportunity.html?oppId=350399
- Application portal link: All abstracts sent in response to HR001123S0051 shall be submitted via DARPA's BAA Website (https://baa.darpa.mil ), full proposals should be submitted using www.grants.gov.
- Other relevant information
- All administrative correspondence and questions on this solicitation, including requests for clarifying information on how to submit an abstract or full proposal to this BAA should be directed to HR001123S0051@darpa.mil .
- DARPA will post a consolidated Question and Answer (FAQ) document on a regular basis. To access the posting go to: http://www.darpa.mil/work-with-us/opportunities . Under the HR001123S0051 summary will be a link to the FAQ. Submit your question/s by e-mail to HR001123S0051@darpa.mil.
Practical information
- General public
- Free