U.S. DOD DARPA - Microsystems Technology Office (MTO) Office-wide

The Microsystems Technology Office (MTO) at DARPA regularly publishes BAAs requesting responses to specific program topics.

MTO seeks to develop high-risk, high-reward technologies. Proposed research should investigate innovative approaches that enable revolutionary advances in science, devices, or systems. Specifically excluded is research that primarily results in evolutionary improvements to the existing state of practice.

As MTO evolves to address future microsystems-related challenges, the office has identified four thrust areas: (1) Embedded Microsystem Intelligence and Localized Processing, (2) Next Generation Front-End Component Technologies for Electromagnetic (EM) Spectrum Dominance, (3) Microsystem Integration for Increased Functional Density and Security, and (4) Disruptive Defense Microsystem Applications. Each of these overlapping spaces present significant opportunities for exploring new and creative technologies.

Areas of Interest:
Research areas of current interest to MTO include, but are not limited to, the following topics:
Advanced RF and EO/IR filters and related front-end components
Advanced imaging architectures and systems
Advanced photonic & electronic interconnects
Atomic physics
Chip-scale sensors
Cold-atom microsystem component technologies
Cognitive and other advanced EW technologies
Compound semiconductor-based electronics and other emerging device technologies
Computational architectures and algorithms for next generation artificial intelligence (AI)
Directed energy component technologies, physics of effects, and protection techniques
Electro-optical/infrared (EO/IR) technologies
Electronics and micro sensors for harsh environments
Energy-efficient computing and advanced signal processing
Hardware assurance, reliability & validation
Heterogeneous integration/assembly technologies (2D, 2.5D, and 3D)
High-energy lasers
High power microwave technologies
Low power electronics
Low temperature electronics
Low volume microsystems manufacturing and assembly
Materials to enable next-generation microelectronics
Metrology and manufacturing tools for multi-chip, multi-technology packaging
Microelectromechanical system technology
Microsystem design & CAD
Microsystems for position, navigation & timing
Microsystems for RF/optical transceivers
Mixed-signal electronics
Multi-domain, integrated tools for virtual prototyping
Novel photonic devices
Processing techniques for imaging and spectral recognition
Quantum devices
Signal processing algorithms and techniques to reduce hardware requirements
Thermal management of microsystems
Other microsystems technology topic areas

DEADLINE:

Abstract Due Date: Abstracts may be submitted on a rolling basis until 1:00PM ET on January 6, 2024.

Proposal Due Date: Proposals may be submitted on a rolling basis until 1:00PM ET on March 16, 2024.

Proposers are strongly encouraged to submit an abstract (maximum of 6 pages, including all figures, tables, and charts) in advance of a proposal to minimize effort and reduce the potential expense of preparing an out-of-scope proposal. DARPA will respond to abstracts providing feedback and indicating whether, after preliminary review, there is interest for the proposed work.

ELIGIBILITY: EPFL researchers are eligible to participate.

HOW TO APPLY: Abstracts and Full Proposals sent in response to HR001122S0030 shall be submitted via DARPA’s BAA Website (https://baa.darpa.mil).

FOR FURTHER INFORMATION: Please refer to the FOA HR001122S0030 and feel free to contact the Research Office or [email protected] for any question or help.